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Solvent based cashew phenol curing agent
| Product Code | Color (Gardner) | Amine Value (mgKOH/g) | Viscosity (25℃,cps) | Solid or Volatile Content (%) | AHEW | Feature | Application |
| T-2301X90 | ≤17 | 265-310 | 3000-5000 | 90±2 | 140 | Solvent-based version of T-2301, better production operability | HDC/IPC/EMC |
| T-601 | ≤17 | 210-270 | 280-600 | 76±2 | 175 | Solvent-based, long pot life, low temperature curing (0℃), good production operability | HDC/IPC/EMC |
| T-603 | ≤15 | 185-210 | 1200-2500 | 70±2 | 172 | Cashew phenol modified phenolic amine curing agent, addition type, long pot life, low temperature curing (0℃), better production operability | HDC/IPC/EMC |
| T-606 | ≤15 | 185-220 | 12000-20000 | 75±2 | 145 | Cashew phenol modified phenolic amine curing agent, addition type, high viscosity, low temperature curing (-5℃), fast curing speed | HDC/IPC/EMC |
| T-607 | ≤16 | 180-210 | 3500-6800 | 70±2 | 200 | Medium viscosity, slow curing speed, long pot life, can meet low surface treatment requirements | HDC/IPC/EMC |
| T-607LV | ≤16 | 170-220 | 1600-5100 | 70±2 | 168 | Low viscosity version of T-607, superior comprehensive performance | HDC/IPC/EMC |
| T-608 | ≤17 | 210-240 | 6500-13000 | 75±2 | 145 | Cashew phenol modified phenolic amine curing agent, addition type, medium viscosity, low temperature curing (-5℃), fast curing speed, dark color | HDC/IPC/EMC |
| T-624 | ≤10 | 200-236 | 3400-5000 | 80±2 | 195 | Cashew phenol modified phenolic amine curing agent, addition type, medium viscosity, high solid content, low temperature curing (0℃), fast hardness development | HDC/IPC/EMC |
| T-627 | ≤16 | 150-180 | 590-860 | 61±1 | 195 | Low viscosity, moderate curing speed, excellent flexibility, long pot life, can be used in low surface treatment systems, better production operability | HDC/IPC/EMC |
| T-215 | ≤17 | 160-210 | 280-1100 | 70±2 | 230 | Phenolic amide curing agent, low temperature curing, high adhesion, better production operability | IPC/EMC/AD |
| T-225 | ≤10 | 165-190 | 620-1500 | 65±1.5 | 183 | Phenolic amide curing agent, low temperature curing, high adhesion, better production operability | IPC/EMC/AD |
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